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Q67040-S4378 Datasheet(PDF) 2 Page - Infineon Technologies AG |
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Q67040-S4378 Datasheet(HTML) 2 Page - Infineon Technologies AG |
2 / 8 page 2003-07-31 Rev.2 Page 2 IDD06E60 Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - case RthJC - - 3.2 K/W SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 1) RthJA - - - - 75 50 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Reverse leakage current VR=600V, Tj=25°C VR=600V, Tj=150°C IR - - - - 50 500 µA Forward voltage drop IF=6A, Tj=25°C IF=6A, Tj=150°C VF - - 1.5 1.5 2 - V 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. |
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