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MLL1.4KESD60 Datasheet(PDF) 1 Page - Microsemi Corporation |
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MLL1.4KESD60 Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 4 page SURFACE MOUNT TVS SCOTTSD A L E DIVISION MLL1.4KESD5.0 thru MLL1.4KESD170CA DESCRIPTION APPEARANCE These small surface mount TVS devices feature the ability to clamp dangerous high voltage short-term transients such as produced by directed or radiated electrostatic discharge phenomena before entering sensitive component regions of a circuit design. They are small economical transient voltage suppressors targeted primarily for short-term transients below a few microseconds while still achieving significant peak-pulse-power capability as illustrated in Figure #1. DO-213AA IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • Excellent protection in clamping direct ESD level transients in excess of 15,000 V per MIL-STD-750, Method 1020 (approx. 150 ns exponential wave) • Absorbs ESD level transients* of 1400 Watts per MIL-STD-750, Method 1020 (approx. 150 ns exponential wave, or one microsecond transients up to 400 watts. See Figure #1 and #2 for overall transient Peak Pulse Power. • Clamps Transients in less than 100 picoseconds • Working Stand-off Voltage range of 5 V to 170 V • Hermetic DO-213AA Package. Also available in axial-leaded DO-35 package (see separate data sheet for 1.4KESD5.0 series) • Protects Sensitive circuits from short duration fast rise time transients such as Electrostatic Discharge (ESD) or Electrical Fast Transients (EFT) • Low inherent capacitance for high-frequency applications (See Figure #4) • Small surface mount foot print • Bidirectional features available by adding a “C” or “CA” suffix MAXIMUM RATINGS MECHANICAL AND PACKAGING • 400 Watts for One Microsecond Square Wave or 1400 watts per ESD Wave form of MIL-STD-750, method 1020 • See Surge Rating curves in Figures #1, 2 and 3 • Operating and storage temperature –65oC to 175oC • THERMAL RESISTANCE: 150oC/W junction to end cap • DC power dissipation 500 mW at TEC ≤ 100oC • Derate at 2.3 W/oC above 25oC for PPP (1µs) and at 6.67 mW/ oC above 100oC for dc power • Forward Surge Current 50 amps for 1µs at TL = 25oC (rise time > 100 ns) • CASE: Hermetically sealed glass DO-213AA surface mount package • TERMINALS: Leads, tin-lead plated solderable per MIL-STD-750, method 2026 • POLARITY: Banded end is cathode • WEIGHT: 0.04 grams (typical) • MARKING: Cathode band only • TAPE & REEL option: Standard per EIA-481-B (add “TR” suffix to part number) • See package dimension on last page Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 Copyright 2003 10-06-2003 REV A |
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