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NTE2375 Datasheet(PDF) 1 Page - NTE Electronics |
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NTE2375 Datasheet(HTML) 1 Page - NTE Electronics |
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1 / 3 page  NTE2375 MOSFET N–Ch, Enhancement Mode High Speed Switch Features: D Dynamic dv/dt Rating D Repetitive Avalanche Rated D Isolated Central Mounting Hole D Fast Switching D Ease of Paralleling D Simple Drive Requirements Absolute Maximum Ratings: Continuous Drain Current (VGS = 10V), ID TC = +25°C 41A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TC = +100°C 29A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pulsed Drain Current (Note 1), IDM 120A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Dissipation (TC = +25°C), PD 230W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Derate Linearly Above 25 °C 1.5W/ °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gate–to–Source Voltage, VGS ±20V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Single Pulse Avalanche Energy (Note 2), EAS 830mJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Avalanche Current (Note 1), IAR 41A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Repetitive Avalanche Energy (Note 1), EAR 19mJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peak Diode Recovery dv/dt (Note 3), dv/dt 5.5V/ns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Junction Temperature Range, TJ –55 ° to +175°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage Temperature Range, Tstg –55 ° to +175°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead Temperature (During Soldering, 1.6mm from case for 10sec), TL +300 °C . . . . . . . . . . . . . . . . . Mounting Torque (6–32 or M3 Screw) 10 lbf in (1.1Nm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Resistance, Junction–to–Case, RthJC 0.65 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Resistance, Junction–to–Ambient, RthJA 40 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical Thermal Resistance, Case–to–Sink (Flat, Greased Surface), RthCS 0.24 °C/W . . . . . . . . . . . Note 1. Repetitive rating; pulse width limited by maximum junction temperature. Note 2. VDD = 25V, starting TJ = +25°C, L = 740µH, RG = 25Ω, IAS = 41A Note 3. ISD ≤ 41A, di/dt ≤ 300A/µs, VDD ≤ V(BR)DSS, TJ ≤ +175°C |
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