TL(RE,RME,SE,OE,YE,PYE,GE,FGE,PGE)50T

2002-01-17

2

==== 25°C)

Product Name

Forward Current

Reverse Voltage

Power Dissipation

Operating

Temperature

Storage

Temperature

TLRE50T

50

4

120

TLRME50T

50

4

120

TLSE50T

50

4

120

TLOE50T

50

4

120

TLYE50T

50

4

120

TLPYE50T

50

4

120

TLGE50T

50

4

120

TLFGE50T

50

4

120

TLPGE50T

50

4

120

-40~100

-40~120

==== 25°C)

Typ. Emission Wavelength

Luminous Intensity

Forward Voltage

Reverse Current

Product Name

Dl

Min

Typ.

Typ.

Max

Max

TLRE50T

630

(644)

20

20

850

1800

20

1.9

2.4

20

50

4

TLRME50T

626

(636)

23

20

850

2200

20

1.9

2.4

20

50

4

TLSE50T

613

(623)

20

20

1530

3500

20

1.9

2.4

20

50

4

TLOE50T

605

(612)

20

20

1530

4500

20

2.0

2.4

20

50

4

TLYE50T

587

(590)

17

20

1530

3500

20

2.0

2.4

20

50

4

TLPYE50T

580

(583)

14

20

850

2500

20

2.0

2.4

20

50

4

TLGE50T

571

(574)

17

20

476

1500

20

2.0

2.4

20

50

4

TLFGE50T

565

(568)

15

20

272

1000

20

2.0

2.4

20

50

4

TLPGE50T

558

(562)

14

20

153

600

20

2.1

2.4

20

50

4

Unit

nm

mA

mcd

mA

V

mA

mA

V

Precautions

Please be careful of the following:

· Soldering temperature: 260°C max, soldering time: 3 s max

(soldering portion of lead: up to 2 mm from the body of the device)

· If the lead is formed, the lead should be formed up to 5 mm from the body of the device without forming stress to

the resin. Soldering should be performed after lead forming.

· This visible LED lamp also emits some IR light.

If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.