SAMB11 Ultra Low Power BLE 4.1 SoC [Datasheet]

Atmel-42426D-SAM-B11-Ultra-Low-Power-BLE-4.1-SoC-Datasheet_08/2016

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10.1 Overview........................................................................................................................................ 34

10.2 I2C Master/Slave Interface ............................................................................................................. 36

10.2.1 Description................................................................................................................... 36

10.2.2 I2C Interface Timing ..................................................................................................... 37

10.3 SPI Master/Slave Interface ............................................................................................................ 38

10.3.1 Description................................................................................................................... 38

10.3.2 SPI Interface Modes .................................................................................................... 39

10.3.3 SPI Slave Timing ......................................................................................................... 40

10.3.4 SPI Master Timing ....................................................................................................... 41

10.4 UART Interface .............................................................................................................................. 42

10.5 GPIOs ............................................................................................................................................ 42

10.6 Analog to Digital Converter (ADC) ................................................................................................. 44

10.6.1 Overview...................................................................................................................... 44

10.6.2 Timing .......................................................................................................................... 44

10.6.3 Performance ................................................................................................................ 45

10.7 Software Programmable Timer and Pulse Width Modulator .......................................................... 48

10.8 Clock Output .................................................................................................................................. 48

10.8.1 Variable Frequency Clock Output Using Fractional Divider ......................................... 48

10.8.2 Fixed Frequency Clock Output .................................................................................... 48

10.9 Three-axis Quadrature Decoder .................................................................................................... 49

11 Reference Design ...................................................................................................... 50

12 Bill of Material (BOM) ................................................................................................ 51

13 Electrical Characteristics.......................................................................................... 52

13.1 Absolute Maximum Ratings ........................................................................................................... 52

13.2 Recommended Operating Conditions ............................................................................................ 52

13.3 DC Characteristics ......................................................................................................................... 53

14 Reflow Profile Information ........................................................................................ 54

14.1 Storage Condition .......................................................................................................................... 54

14.1.1 Moisture Barrier Bag Before Opened........................................................................... 54

14.1.2 Moisture Barrier Bag Open .......................................................................................... 54

14.2 Stencil Design................................................................................................................................ 54

14.3 Baking Conditions .......................................................................................................................... 54

14.4 Soldering and Reflow Condition..................................................................................................... 54

14.4.1 Reflow Oven ................................................................................................................ 54

15 Errata.......................................................................................................................... 56

16 Reference Documentation and Support................................................................... 57

16.1 Reference Documents ................................................................................................................... 57

17 Document Revision History ...................................................................................... 58