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TDA7519TR Datasheet(PDF) 5 Page - STMicroelectronics |
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TDA7519TR Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 7 page TDA7519 Package information 5/7 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. LQFP44 (10x10) Mechanical data and package dimensions. OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 1.60 0.063 A1 0.05 0.15 0.002 0.006 A2 1.35 1.40 1.45 0.053 0.055 0.057 B 0.30 0.37 0.45 0.012 0.015 0.018 C 0.09 0.20 0.004 0.008 D 11.80 12.00 12.20 0.464 0.472 0.480 D1 9.80 10.00 10.20 0.386 0.394 0.401 D3 8.00 0.315 E 11.80 12.00 12.20 0.464 0.472 0.480 E1 9.80 10.00 10.20 0.386 0.394 0.401 E3 8.00 0.315 e0.80 0.031 L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.00 0.039 k 0˚(min.), 3.5˚(typ.), 7˚(max.) ccc 0.10 0.0039 LQFP44 (10 x 10 x 1.4mm) 0076922 E |
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