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SI4719CY Datasheet(PDF) 2 Page - Vishay Siliconix |
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SI4719CY Datasheet(HTML) 2 Page - Vishay Siliconix |
2 / 8 page Si4719CY Vishay Siliconix www.vishay.com S FaxBack 408-970-5600 2-2 Document Number: 70669 S-59510—Rev. B, 31-Aug-98 ABSOLUTE MAXIMUM RATINGS Voltage Referenced to GND VS, VDa –0.3 V to 32 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSD –0.3 V to 30 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VIN1, VIN2 –0.3 V to 15 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS 20 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage Temperature –55 to 150 _C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Dissipationb (t = 10 sec) 2.4 W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (t = steady state) 1.5 W . . . . . . . . . . . . . . . . . . . . . . . . . . . Notes a. VSD ≤ 30 VDC b. Device mounted with all leads soldered to 1” x 1” FR4 with laminated copper PC board. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING RANGE VS, VD 6 V to 30 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VIN1, VIN2 0 V to 13.2 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDS 0 A to 6 A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Temperature Range –25 to 85 _C . . . . . . . . . . . . . . . . . . . . . . . . . . . Junction Temperature –25 to 150 _C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPECIFICATIONS P Sb l S ifi T C di i Limits Parameter Symbol Specific Test Conditions Tempa Minb Typc Maxb Unit On-Resistance rDS VS = 10 V, ID = 1 A, VIN = H Room 0.028 0.040 W Leakage Current IDS(off) VDS = 10 V Room 1 A Power Consumption IS GND(off) VS = 21 V Room 1 mA Power Consumption IS GND(on) VS = 21 V Room 1.0 10 Input Voltage Low VINL VS = 10 V and VS = 21 V Full 3.3 V Input Voltage High VINH VS = 10 V and VS = 21 V Full 4.5 V Input Current IINH VIN = 5.0 V Room 25 50 mA Turn-On Delay IN tD S tON(IN) VS = 10 V, RL = 5 W, Test Circuit 1 Room 2.2 2.9 10 Turn-Off Delay to D or S tOFF(IN) VS = 10 V, RL = 5 W, Test Circuit 1 Room 1.15 2 ms Break-Before-Maked tBBM Room 1.15 ms Rise Time tRISE Room 0,73 1.4 Fall Time tFALL Room 24 50 ns Voltage Across Pin 6 and 7 VGS VS = 30 V Room 10.2 18 V Forward Diode VSD ID = –1 A Room 1.1 V Notes a. Room = 25 _C, Full = as determined by the operating temperature suffix. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum. c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. d. Guaranteed by design, not subject to production testing. |
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