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LMZM23600 Datasheet(PDF) 5 Page - Texas Instruments |
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LMZM23600 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 36 page 5 LMZM23600 www.ti.com SNVSB53 – FEBRUARY 2018 Product Folder Links: LMZM23600 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN to GND –0.3 42 V SW to GND –0.3 VIN + 0.3 V BOOT to SW –0.3 3.6 V EN to GND –0.3 42 V FB to GND (3.3-V and 5-V options) –0.3 16 V FB to GND (ADJ option) –0.3 5.5 V PGOOD to GND –0.3 16 V PGOOD sink current 8 mA MODE/SYNC to GND –0.3 42 V VCC to GND -0.3 3.6 V Operating junction temperature, TJ –40 125 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±250 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 4 36 V VOUT Output voltage (5 V) 0 5 V Output voltage (3.3 V) 0 3.3 V Output voltage (ADJ) 2.5 15 V IOUT Output current (0.5 A) 0 0.5 A TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) LMZM23601 UNIT SIL (USIP) 10 PINS RθJA Junction-to-ambient thermal resistance 45 °C/W ΨJT Junction-to-top characterization parameter 3 °C/W ΨJB Junction-to-board characterization parameter 20 °C/W |
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