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TE28F032B3T90 Datasheet(PDF) 1 Page - Intel Corporation |
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TE28F032B3T90 Datasheet(HTML) 1 Page - Intel Corporation |
1 / 48 page E PRELIMINARY July 1998 Order Number: 290580-005 n Flexible SmartVoltage Technology 2.7 V–3.6 V Read/Program/Erase 12 V VPP Fast Production Programming n 2.7 V or 1.65 V I/O Option Reduces Overall System Power n High Performance 2.7 V–3.6 V: 90 ns Max Access Time 3.0 V–3.6 V: 80 ns Max Access Time n Optimized Block Sizes Eight 8-KB Blocks for Data, Top or Bottom Locations Up to Sixty-Three 64-KB Blocks for Code n Block Locking VCC-Level Control through WP# n Low Power Consumption 10 mA Typical Read Current n Absolute Hardware-Protection VPP = GND Option VCC Lockout Voltage n Extended Temperature Operation –40 °C to +85 °C n Flash Data Integrator Software Flash Memory Manager System Interrupt Manager Supports Parameter Storage, Streaming Data (e.g., Voice) n Automated Program and Block Erase Status Registers n Extended Cycling Capability Minimum 100,000 Block Erase Cycles Guaranteed n Automatic Power Savings Feature Typical ICCS after Bus Inactivity n Standard Surface Mount Packaging 48-Ball µBGA* Package 48-Lead TSOP Package 40-Lead TSOP Package n Footprint Upgradeable Upgrade Path for 4-, 8-, 16-, and 32- Mbit Densities n ETOX™ VI (0.25 µ) Flash Technology The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature- rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective, monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40- lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash. SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F008B3, 28F016B3, 28F032B3 |
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