© Koninklijke Philips Electronics N.V. 2002.

Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

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thereof does not convey nor imply any license under patent- or other industrial or

intellectual property rights.

Date of release: 6 August 2002

Document order number: 9397 750 09882

Contents

Philips Semiconductors

BUK75/7609-55A

TrenchMOS™ standard level FET

1

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4

Pinning information . . . . . . . . . . . . . . . . . . . . . . 1

5

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

6

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

7

Thermal characteristics. . . . . . . . . . . . . . . . . . . 4

7.1

Transient thermal impedance . . . . . . . . . . . . . . 4

8

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5

9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

10

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

11

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13

12

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 14

13

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

14

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

15

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14