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ISL8011IRZ-T Datasheet(PDF) 9 Page - Renesas Technology Corp |
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ISL8011IRZ-T Datasheet(HTML) 9 Page - Renesas Technology Corp |
9 / 10 page FN9254 Rev 2.00 Page 9 of 10 August 4, 2009 ISL8011 Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com For additional products, see www.intersil.com/en/products.html © Copyright Intersil Americas LLC 2006-2009. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. converter, the power loop is composed of the output inductor L, the output capacitor COUT, Phase pin and PGND pin. It is necessary to make the power loop as small as possible. In order to make the output voltage regulate well and avoid the noise coupling from the power loop, SGND pin should be connected with PGND pin at the terminals of the load. The heat of the IC is mainly dissipated through the thermal pad. Maximizing the copper area connected to the thermal pad is preferable. In addition, a solid ground plane is helpful for EMI performance. |
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