ISL78302A

FN7932 Rev 2.00

Page 3 of 12

December 22, 2015

Pin Configuration

ISL78302A

(10 LD 3X3 DFN)

TOP VIEW

Pin Descriptions

PIN NUMBER PIN NAME

TYPE

DESCRIPTION

1

VIN

Analog I/O

Supply Voltage/LDO Input. Connect a 1µF capacitor to GND.

2

EN1

Low Voltage Compatible CMOS Input LDO-1 Enable

3

EN2

Low Voltage Compatible CMOS Input LDO-2 Enable

4

CBYP

Analog I/O

Reference Bypass Capacitor Pin. Optionally connect capacitor of value 0.01µF to 1µF

between this pin and GND to tune in the desired noise and PSRR performance.

5

CPOR

Analog I/O

POR2 Delay Setting Capacitor Pin. Connect a capacitor between this pin and GND to

delay the POR2 output release after LDO-2 output reaches 94% of its specified

voltage level (200ms delay per 0.01µF).

6

GND

Ground

Connection to system ground. Connect to PCB Ground plane.

7POR1

Open Drain Output (1mA)

Open-drain POR Output for LDO-1 (active-low). Internally connected to VO1 through

100kΩ resistor.

8POR2

Open Drain Output (1mA)

Open-drain POR Output for LDO-2 (active-low). Internally connected to VO2 through

100kΩ resistor.

9

VO2

Analog I/O

LDO-2 Output. Connect capacitor of value 1µF to 10µF to GND

(1µF recommended).

10

VO1

Analog I/O

LDO-1 Output. Connect capacitor of value 1µF to 10µF to GND

(1µF recommended).

VIN

EN1

EN2

CBYP

CPOR

VO1

VO2

POR2

POR1

GND

2

3

4

1

5

9

8

7

10

6

Ordering Information

PART NUMBER

(Notes 1, 2, 3)

PART

MARKING

VO1 VOLTAGE

(V)

VO2 VOLTAGE

(V)

TEMP RANGE

(°C)

PACKAGE

(RoHS Compliant)

PKG DWG. #

ISL78302AARMMZ

DNAL

3.0

3.0

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302AARLLZ

DNAM

2.9

2.9

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302AARJMZ

DNAN

2.8

3.0

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302AARJRZ

DNAP

2.8

2.6

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302AARJCZ

DNAK

2.8

1.8

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302AARGCZ

DNAR

2.7

1.8

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302AARPLZ

DNAS

1.85

2.9

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302AARBJZ

DNAT

1.5

2.8

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

NOTES:

1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information page for ISL78302A. For more information on MSL, please see Tech Brief TB363.