1

VCAP

8

VDD2

2

IN

7

OUTP

3

VDD1

6

OUTN

4

GND1

5

GND2

Not to scale

3

ISO224

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SBAS738 – JUNE 2018

Product Folder Links: ISO224

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5 Device Comparison Table

PARAMETER

ISO224B

ISO224A

±5 mV (max)

±50 mV (max)

±45 µV/°C (max)

±60 µV/°C (max)

±0.3% (max)

±0.5% (max)

±50 ppm/°C (max)

±60 ppm/°C (max)

Input-referred noise

3.1 µV/

√Hz (typ)

4 µV/

√Hz (typ)

Nonlinearity

±0.01% (max)

±0.02% (max)

Output bandwidth, BW

275 kHz (typ)

175 kHz (typ)

IN to OUTP, OUTN signal delay (50% – 50%)

2.1 µs (typ)

2.8 µs (typ)

6 Pin Configuration and Functions

DWV Package

8-Pin SOIC

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NO.

NAME

1

VCAP

—

Supply decoupling capacitor. Connect a 0.22-µF capacitor between this pin and the high-side analog

ground.

2

IN

I

Analog input

3

VDD1

—

High-side power supply, 4.5 V to 18 V.

See the Power Supply Recommendations section for decoupling recommendations.

4

GND1

—

High-side analog ground

5

GND2

—

Low-side analog ground

6

OUTN

O

Inverting analog output

7

OUTP

O

Noninverting analog output

8

VDD2

—

Low-side power supply, 4.5 V to 5.5 V.

See the Power Supply Recommendations section for decoupling recommendations.