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TLV2772A Datasheet(PDF) 1 Page - Texas Instruments |
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TLV2772A Datasheet(HTML) 1 Page - Texas Instruments |
1 / 32 page TLV2772, TLV2772A, TLV2772Y 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT DUAL OPERATIONAL AMPLIFIERS SLOS209 – JANUARY 1998 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D High Slew Rate... 10.5 V/µs Typ D High-Gain Bandwidth... 5.1 MHz Typ D Supply Voltage Range 2.7 V to 5 V D Rail-to-Rail Output D 360 µV Input Offset Voltage D Low Distortion Driving 600-Ω 0.005% THD+N D 1 mA Supply Current (Per Channel) D 17 nV/√Hz Input Noise Voltage D 2 pA Input Bias Current D Characterized from TA = –40°C to 125°C D Available in MSOP (DGK) Package description The TLV2772 dual CMOS operational amplifier combines high slew rate and bandwidth, rail-to-rail output swing, high output drive and excellent dc precision. The device provides 10.5 V/ µs of slew rate and 5.1 MHz of bandwidth while only consuming 1 mA of supply current per channel. This ac performance is much higher than current competitive CMOS amplifiers. The rail-to-rail output swing and high output drive makes this device a good choice for driving the analog input or reference of analog-to-digital converters. The device also has low distortion while driving a 600- Ω load for use in telecom systems. The amplifier has a 360 µV input offset voltage, a 17 nV Hz input noise voltage, and a 2 pA input bias current for measurement, medical, and industrial applications. The TLV2772 is also specified across an extended temperature range (– 40 °C to 125°C) making it useful for automotive systems. The device operates from a 2.2 V to 5.5 V single supply voltage and is characterized at 2.7 V and 5 V. The single supply operation and low power consumption make this device a good solution for portable applications. It is available in an 8-pin PDIP, SOIC and ultra-low profile MSOP package. AVAILABLE OPTIONS PACKAGED DEVICES CHIP FORM‡ TA VIOmax AT 25°C SMALL OUTLINE† (D) MSOP (DGK) PLASTIC DIP (P) CHIP FORM‡ (Y) 0 °C to 70°C 2.5 TLV2772CD TLV2772CDGK TLV2772CP –40 °C to 125°C 2.5 1.6 TLV2772ID TLV2772AID TLV2772IDGK TLV2772AIDGK TLV2772IP TLV2772AIP TLV2772Y † The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLV2772CDR). ‡ Chip forms are tested at TA = 25°C only. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 8 7 6 5 1OUT 1IN – 1IN + VDD–/GND VDD+ 2OUT 2IN – 2IN+ D OR P PACKAGE (TOP VIEW) 1 2 3 4 8 7 6 5 1OUT 1IN – 1IN+ VDD–/GND VDD+ 2OUT 2IN – 2IN+ DGK PACKAGE (TOP VIEW) This document contains information on products in more than one phase of development. The status of each device is indicated on the page(s) specifying its electrical characteristics. Copyright © 1998, Texas Instruments Incorporated |
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