4

 2003 Semtech Corp.

www.semtech.com

PRELIMINARY

PROTECTION PRODUCTS

SFC2309-200

Applications Information

Device Connection Options

The SFC2309-200 has solder bumps located in a 5 x 5

matrix layout on the active side of the device. The

bumps are designated by the numbers 1 - 5 along the

horizontal axis and letters A - E along the vertical axis.

The input of the lines to be protected are connected at

bumps A1 - A5 and B1 - B5. The line outputs are

connected at bumps D1 - D5 and E1 - E5. Bumps C1 -

C5 are connected to ground. All path lengths should

be kept as short as possible to minimize the effects of

parasitic inductance in the board traces.

Wafer Level CSP TVS

CSP TVS devices are wafer level chip scale packages.

They eliminate external plastic packages and leads and

thus result in a significant board space savings. Manu-

facturing costs are minimized since they do not require

an intermediate level interconnect or interposer layer

for reliable operation. They are compatible with cur-

rent pick and place equipment further reducing manu-

facturing costs. Certain precautions and design

considerations have to be observed however for

maximum solder joint reliability. These include solder

pad definition, board finish, and assembly parameters.

Printed Circuit Board Mounting

Non-solder mask defined (NSMD) land patterns are

recommended for mounting flip chip devices. Solder

mask defined (SMD) pads produce stress points at the

solder mask to solder ball interface that can result in

solder joint cracking when exposed to extreme fatigue

conditions. The recommended pad size is 0.275 ±

0.010 mm with a minimum solder mask opening of

0.325 mm.

Grid Courtyard

The recommended grid placement courtyard is 2.7 x

2.7 mm. The grid courtyard is intended to encompass

the land pattern and the component body that is

centered in the land pattern. When placing parts on a

PCB, the highest recommended density is when one

courtyard touches another.

Pin Identification and Configuration (Ball Side View)

n

i

Pn

o

i

t

a

c

i

f

i

t

n

e

d

I

5

A

-

1

A5

,

4

,

3

,

2

,

1

s

e

n

i

L

,t

u

p

n

I

5

B

-

1

B0

1

,

9

,

8

,

7

,

6

s

e

n

i

L

,t

u

p

n

I

5

C

-

1

Cd

n

u

o

r

G

5

D

-

1

D0

1

,

9

,

8

,

7

,

6

s

e

n

i

L

,t

u

p

t

u

O

5

E

-

1

E5

,

4

,

3

,

2

,

1

s

e

n

i

L

,t

u

p

t

u

O

Layout Example (Ball Side View)

1

6273

8

4

9

5

10

61

728

3

9

4 10

5

Output

Input