Si8415DB

Vishay Siliconix

New Product

www.vishay.com

6

Document Number: 73210

S-50037—Rev. A, 17-Jan-05

PACKAGE OUTLINE

MICRO FOOT: 4-BUMP (2 X 2, 0.8-mm PITCH)

NOTES (Unless Otherwise Specified):

1.

Laser mark on the silicon die back, coated with a thin metal.

2.

Bumps are Eutectic solder 63/57 Sn/Pb.

3.

Non-solder mask defined copper landing pad.

4.

The flat side of wafers is oriented at the bottom.

Bump Note 2

8415

XXX

Recommended Land

Mark on Backside of Die

Silicon

4

O 0.30 X 0.31

Note 3

Solder Mask O X 0.40

b Diamerter

e

e

A

e

S

D

e

S

E

MILLIMETERS*

INCHES

Dim

Min

Max

Min

Max

A

0.600

0.650

0.0236

0.0256

0.260

0.290

0.0102

0.0114

0.340

0.360

0.0134

0.0142

b

0.370

0.410

0.0146

0.0161

D

1.520

1.600

0.0598

0.0630

E

1.520

1.600

0.0598

0.0630

e

0.750

0.850

0.0295

0.0335

S

0.370

0.380

0.0146

0.0150

* Use millimeters as the primary measurement.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and

Package Reliability represent a composite of all qualified locations.

For related documents such as package/tape drawings, part marking, and reliability data, see

http://www.vishay.com/ppg?73210.