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THS3122IDRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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THS3122IDRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 20 page THS3122 THS3125 SLOS382 − SEPTEMBER 2001 2 www.ti.com AVAILABLE OPTIONS PACKAGED DEVICE EVALUATION TA SOIC-8 (D) SOIC-8 PowerPAD (DDA) SOIC-14 (D) TSSOP-14 (PWP) EVALUATION MODULES 0 °C to 70°C THS3122CD THS3122CDDA THS3125CD THS3125CPWP THS3122EVM −40 °C to 85°C THS3122ID THS3122IDDA THS3125ID THS3125IPWP THS3122EVM THS3125EVM absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC+ to VCC− 33 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage ± VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current (see Note 1) 275 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential input voltage ± 4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Total power dissipation at (or below) 25 °C free-air temperature See Dissipation Ratings Table . . . . . . . . . . . Operating free-air temperature, TA: Commercial 0 °C to 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Industrial −40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg : Commercial −65 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Industrial −65 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The THS3122 and THS3125 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. DISSIPATION RATING TABLE PACKAGE θJA TA = 25°C POWER RATING D-8 95 °C/W‡ 1.32 W DDA 67 °C/W 1.87 W D-14 66.6 °C/W‡ 1.88 W PWP 37.5 °C/W 3.3 W ‡ This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test PCB, the θJA is168°C/W for the D-8 package and 122.3 °C/W for the D-14 package. recommended operating conditions MIN NOM MAX UNIT Supply voltage, VCC+ to VCC− Dual supply ±5 ±15 V Supply voltage, VCC+ to VCC− Single supply 10 30 V Operating free-air temperature, TA C-suffix 0 70 °C Operating free-air temperature, TA I-suffix −40 85 °C Shutdown pin input levels, relative to the GND pin High level (device shutdown) 2 V Shutdown pin input levels, relative to the GND pin Low level (device active) 0.8 V |
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