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SI5504DC Datasheet(PDF) 1 Page - Vishay Siliconix |
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SI5504DC Datasheet(HTML) 1 Page - Vishay Siliconix |
1 / 7 page Si5504DC Vishay Siliconix Document Number: 71056 S-21251—Rev. B, 05-Aug-02 www.vishay.com 2-1 Complementary 30-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A) 0.085 @ VGS = 10 V "3.9 N-Channel 30 0.143 @ VGS = 4.5 V "3.0 0.165 @ VGS = -10 V "2.8 P-Channel -30 0.290 @ VGS = -4.5 V "2.1 Bottom View D1 G1 S1 N-Channel MOSFET S2 G2 D2 P-Channel MOSFET 1206-8 ChipFET S1 G1 S2 G2 D1 D1 D2 D2 1 Marking Code EA XX Lot Traceability and Date Code Part # Code Ordering Information: Si5504DC-T1 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) N-Channel P-Channel Parameter Symbol 5 secs Steady State 5 secs Steady State Unit Drain-Source Voltage VDS 30 -30 Gate-Source Voltage VGS "20 V _ TA = 25_C "3.9 "2.9 "2.8 "2.1 Continuous Drain Current (TJ = 150_C)a TA = 85_C ID "2.8 "2.1 "2.0 "1.5 Pulsed Drain Current IDM "10 A Continuous Source Current (Diode Conduction)a IS 1.8 0.9 -1.8 -0.9 TA = 25_C 2.1 1.1 2.1 1.1 Maximum Power Dissipationa TA = 85_C PD 1.1 0.6 1.1 0.6 W Operating Junction and Storage Temperature Range TJ, Tstg -55 to 150 _ Soldering Recommendations (Peak Temperature)b, c 260 _C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit t v 5 sec 50 60 Maximum Junction-to-Ambienta Steady State RthJA 90 110 _C/W Maximum Junction-to-Foot (Drain) Steady State RthJF 30 40 C/W Notes a. Surface Mounted on 1” x 1” FR4 Board. b. See Reliability Manual for profile. The ChipFET/PowerPAK is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. |
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