4

TLV1704-SEP

SLOSE29 – NOVEMBER 2018

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Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

(3)

Short-circuit to ground; one comparator per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

40 (±20)

V

Signal input pins

V

±10

mA

Continuous

mA

–55

125

°C

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

Charged-device model (CDM), per AEC Q100-011

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.2 (±1.1)

36 (±18)

V

Specified temperature

–55

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TLV1704-SEP

UNIT

PW (TSSOP)

14 PINS

Junction-to-ambient thermal resistance

128.1

°C/W

Junction-to-case (top) thermal resistance

56.5

°C/W

Junction-to-board thermal resistance

69.9

°C/W

Junction-to-top characterization parameter

9.1

°C/W

Junction-to-board characterization parameter

69.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W