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TLV1704AMPWPSEP Datasheet(PDF) 4 Page - Texas Instruments |
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TLV1704AMPWPSEP Datasheet(HTML) 4 Page - Texas Instruments |
4 / 22 page 4 TLV1704-SEP SLOSE29 – NOVEMBER 2018 www.ti.com Product Folder Links: TLV1704-SEP Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be current limited to 10 mA or less. (3) Short-circuit to ground; one comparator per package. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage 40 (±20) V Signal input pins Voltage(2) (VS–) – 0.5 (VS+) + 0.5 V Current(2) ±10 mA Output short-circuit(3) Continuous mA Operating Junction temperature, TJ –55 125 °C Storage temperature, Tstg –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±1000 V Charged-device model (CDM), per AEC Q100-011 ±1000 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage VS = (VS+) – (VS–) 2.2 (±1.1) 36 (±18) V Specified temperature –55 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TLV1704-SEP UNIT PW (TSSOP) 14 PINS RθJA Junction-to-ambient thermal resistance 128.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 56.5 °C/W RθJB Junction-to-board thermal resistance 69.9 °C/W ψJT Junction-to-top characterization parameter 9.1 °C/W ψJB Junction-to-board characterization parameter 69.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W |
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