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HSDL-3003-021 Datasheet(PDF) 11 Page - Agilent(Hewlett-Packard) |
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HSDL-3003-021 Datasheet(HTML) 11 Page - Agilent(Hewlett-Packard) |
11 / 21 page 11 Moisture Proof Packaging All HSDL-3003 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. Package Temp. Time In reels 60 °C ≥ 48 hours In bulk 100 °C ≥ 4 hours 125 °C ≥ 2 hours 150 °C ≥ 1 hour Baking should only be done once. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Recommended Storage Conditions Storage Temperature 10 °C to 30°C Relative Humidity below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within two days if stored at the recom- mended storage conditions. If times longer than 72 hours are needed, the parts must be stored in a dry box. Figure 14. Baking conditions chart. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 25°C, AND LESS THAN 60% RH? PACKAGE IS OPENED MORE THAN 72 HOURS? PERFORM RECOMMENDED BAKING CONDITIONS NO BAKING IS NECESSARY YES NO YES NO |
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