Substrate Bending Test

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

0.8mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

Fig.1 (in mm)

・Pressurization Method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady), Durability

Resistance to Soldering Heat (Reflow Method)

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

1.6mm or 0.8mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

Fig.3

Step

Temperature(℃)

Time (min)

1

Min.Operating Temp. +0/-3

30+/-3

2

Reference Temp.

2 to 3

3

Max.Operating Temp. +3/-0

30+/-3

4

Reference Temp.

2 to 3

Dimension(mm)

a

b

c

0.2

0.56

0.23

Series

GRM02

Dimension(mm)

a

b

c

0.2

0.56

0.23

Series

GRM02

Step

Temperature(°C)

Applying Voltage

1

Reference Temp. +/-2

2

Min. Operating Temp. +/-3

3

*

Reference Temp. +/-2

4

Max. Operating Temp. ±3

5

Reference Temp. +/-2

No bias

45

45

Flexure

Capacitance meter

Pressurization speed

1.0mm/s

Support

Capacitor

Pressurize

45

45

R5

20

50min.

b

a

Solder Resist

Chip Capacitor

Land

*1,2：2.0±0.05

100

a

4.0±0.1

b

Land

4.5

Solder Resist (Coat with heat resistant resin for solder)

GRM022R71C271ME14-01A