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TE28F016B3BA110 Datasheet(PDF) 11 Page - Intel Corporation |
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TE28F016B3BA110 Datasheet(HTML) 11 Page - Intel Corporation |
11 / 58 page 28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 3UHOLPLQDU\ 5 0580_03 NOTES: 1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address solder balls. Routing is not recommended in this area. A19 is the upgrade address for the 16-Mbit device. A20 is the upgrade address for the 32-Mbit device. A21 is the upgrade address for the 64-Mbit device. 2. 4-Mbit density not available in µBGA CSP. Table 2, “3 Volt Advanced Boot Block Pin Descriptions” on page 6 details the usage of each device pin. Figure 4. x16 48-Ball Very Thin Profile Pitch BGA and µBGA* Chip Size Package (Top View, Ball Down) A 13 A 14 A 15 A 16 V CCQ A 11 A 10 A 12 D 14 D 15 A 8 WE# A 9 D 5 D 6 V PP RP# D 11 D 12 WP# A 20 D 2 D 3 A 19 A 17 A 6 D 8 D 9 A 7 A 5 A 3 CE# D 0 A 4 A 2 A 1 A 0 GND GND D 7 D 13 D 4 V CC D 10 D 1 OE# A B C D E F 13 25 47 68 16M 32M A 18 A 21 64M |
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