TE28F640B3TC100 datasheet(11/58 Pages) INTEL

Part #	TE28F640B3TC100

Description	3 Volt Advanced Boot Block Flash Memory

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Manufacturer	INTEL [Intel Corporation]

Direct Link	http://www.intel.com

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28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

3UHOLPLQDU\

5

0580_03

NOTES:

1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the

upper address solder balls. Routing is not recommended in this area. A19 is the upgrade address for the

16-Mbit device. A20 is the upgrade address for the 32-Mbit device. A21 is the upgrade address for the 64-Mbit

device.

2. 4-Mbit density not available in

µBGA CSP.

Table 2, “3 Volt Advanced Boot Block Pin Descriptions” on page 6 details the usage of each device

pin.

Figure 4. x16 48-Ball Very Thin Profile Pitch BGA and µBGA* Chip Size Package (Top View,

Ball Down)

A

13

A

14

A

15

A

16

V

CCQ

A

11

A

10

A

12

D

14

D

15

A

8

WE#

A

9

D

5

D

6

V

PP

RP#

D

11

D

12

WP#

A

20

D

2

D

3

A

19

A

17

A

6

D

8

D

9

A

7

A

5

A

3

CE#

D

0

A

4

A

2

A

1

A

0

GND

D

7

D

13

D

4

V

CC

D

10

D

1

OE#

A

B

C

D

E

F

13

25

47

68

16M

32M

A

18

A

21

64M

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TE28F640B3TC100 Datasheet(PDF) 11 Page - Intel Corporation

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