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GBU8005 Datasheet(PDF) 1 Page - Guangdong Juxing Electronics Technology Co., Ltd.

Part No. GBU8005
Description  BRIDGE RECTIFIERS
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Maker  JUXING [Guangdong Juxing Electronics Technology Co., Ltd.]
Homepage  http://www.trr-jx.com
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GBU
MECHANICAL DATA
Case: Molded plastic, GBU
Epoxy: UL 94V-O rate flame retardant
Terminals: Leads solderable per MIL-STD-202,
method 208 guaranteed
Mounting position: Any
Weight: 0.15ounce, 4.0gram
Maximum Ratings and Electrical Characteristics
Ratings at 25ambient temperature unless otherwise specified.
Single phase, half wave, 60HZ, resistive or inductive load.
For capacitive load, derate current by 20%.
Dimensions in inches and (millimeters)
DimMin
Max
A
21.8
22.3
B
3.5
4.1
C
7.4
7.9
D
1.65
2.16
E
2.25
2.75
G
1.02
1.27
H
4.83
5.33
J
17.5
18.0
K
4.2 X 45°
L
18.3
18.8
M
3.30
3.56
N
0.46
0.56
P
0.76
1.0
- ~ ~ +
A
B
K
D
E
F
G
H
J
M
N
P
L
C
BRIDGE RECTIFIERS
GBU8005 THRU GBU810
FEATURES
· Glass passivated chip junction
· Reliable low cost construction utilizing molded
plastic technique
· Ideal for printed circuit board
· Low forward voltage drop
· Low reverse leakage current
· High surge current capability
F
2.05
2.3
· UL Recognized File # E469616
31
1.1
@IF=8A
@IF=4A
Forward Voltage per element
150
8.0
8005
810
808
806
804
802
801
10.9
75
1.0
GBU
GBU
GBU
SYMBOL
VRRM
VRWM
VDC
VRMS
35
70
140
280
420
560
700
VFM
RθJA
RθJL
TJ,TSTG
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
Operating and Storage Temperature Range
RMS Reverse Voltage
-55to+150
uA
Typical Junction Capacitance per leg
pF
℃/W
IR
5.0
500
A
V
IFSM
UNITS
V
V
A
1000
100
200
400
600
800
50
TYPE NUMBER
GBU
GBU
GBU
GBU
Peak Reverse Current
@T =25
At Rated DC Blocking Voltage
@T =125
A
A
CJ
Average Rectified Output Current (Note 1)@T =90℃
C
Rating for fusing (t <8.3ms)
I
2
t
93
A s
2
I
2
t
(Note 2)
Typical Thermal Resistance per leg (Note 3)
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
Note:1. Mounted on glass epoxy PC board with 1.3mm2 solder pad.
3. Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink.
IF(AV)
http://www.trr-jx.com
version: 02




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