Philips Semiconductors

BUK95/9609-55A

TrenchMOS™ logic level FET

Product data

Rev. 01 — 21 February 2002

4 of 14

9397 750 09229

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

7.

Thermal characteristics

7.1 Transient thermal impedance

Table 4:

Thermal characteristics

Symbol Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction to

mounting base

Figure 4

-

-

0.71

K/W

thermal resistance from junction to ambient

vertical in still air; SOT78 package

-

60

-

K/W

mounted on a printed circuit board;

minimum footprint; SOT404 package

-

50

-

K/W

Fig 4.

Transient thermal impedance from junction to mounting base as a function of pulse duration.

03nh26

10-3

10-2

10-1

1

10-6

10-5

10-4

10-3

10-2

10-1

1

tp (s)

Zth(j

-mb)

(K/W)

d = 0.5

0.2

0.1

0.05

0.02

single shot

tp

tp

T

P

t

T