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CAT24FC02UITE13REV-E Datasheet(PDF) 2 Page - Catalyst Semiconductor |
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CAT24FC02UITE13REV-E Datasheet(HTML) 2 Page - Catalyst Semiconductor |
2 / 10 page CAT24FC02 2 Doc. No. 1072, Rev. G © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice CAPACITANCE TA = 25°C, f = 400 kHz, VCC = 5 V Symbol Test Conditions Min Typ Max Units CI/O(3) Input/Output Capacitance (SDA) VI/O = 0 V 8 pF CIN(3) Input Capacitance (other pins) VIN = 0 V 6 pF RELIABILITY CHARACTERISTICS (3) Symbol Parameter Min Typ Max Units NEND Endurance 1,000,000 Cycles/Byte TDR Data Retention 100 Years VZAP ESD Susceptibility 4000 Volts ILTH(4) Latch-up 100 mA ABSOLUTE MAXIMUM RATINGS* Temperature Under Bias –55 °C to +125°C Storage Temperature ....................... –65 °C to +150°C Voltage on Any Pin with Respect to Ground(1) ............ –2.0 V to VCC + 2.0 V VCC with Respect to Ground ............. –2.0 V to +7.0 V Package Power Dissipation Capability (TA = 25 °C) .................................. 1.0 W Note: (1) The minimum DC input voltage is –0.5 V. During transitions, inputs may undershoot to –2.0 V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC + 0.5 V, which may overshoot to VCC + 2.0 V for periods of less than 20 ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100 and JEDEC test methods. (4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1.0 V to VCC + 1.0 V. (5) Maximum standby current (ISB) = 10µA for the Extended Automotive temperature range. D.C. OPERATING CHARACTERISTICS VCC = 2.5 V to 5.5 V, unless otherwise specified. Symbol Parameter Test Conditions Min Typ Max Units ICC Power Supply Current (Read) fSCL = 400 kHz 1 mA ICC Power Supply Current (Write) fSCL = 400 kHz 3 mA ISB(5) Standby Current (VCC = 5.0 V) VIN = GND or VCC 1 µA ILI Input Leakage Current VIN = GND to VCC 1 µA ILO Output Leakage Current VOUT = GND to VCC 1 µA VIL Input Low Voltage –1VCC x 0.3 V VIH Input High Voltage VCC x 0.7 VCC + 1.0 V VOL Output Low Voltage (VCC = 3.0 V) IOL = 3 mA 0.4 V Lead Soldering Temperature (10 seconds) ...... 300 °C Output Short Circuit Current(2) ....................... 100 mA *COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. |
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