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AIC1731-28PVBG Datasheet(PDF) 9 Page - Analog Intergrations Corporation |
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AIC1731-28PVBG Datasheet(HTML) 9 Page - Analog Intergrations Corporation |
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9 / 10 page  AIC1731 9 DETAILED DESCRIPTIONS OF TECHNICAL TERMS DROPOUT VOLTAGE (VDROP) The dropout voltage is defined as the difference between the input voltage and output voltage at which the output voltage drops 100mV. Below this value, the output voltage will fall as the input voltage reduces. It depends on the load current and junction temperature. LINE REGULATION Line regulation is the ability of the regulator to maintain a constant output voltage as the input voltage changes. The line regulation is specified as the input voltage changes from VIN = VOUT + 1V to VIN = 7V and IOUT = 1mA. LOAD REGULATION Load regulation is the ability of the regulator to maintain a constant output voltage as the load current changes. A pulsed measurement with an input voltage set to VIN = VOUT + VDROP can minimize temperature effects. The load regulation is specified by the output current ranging from 0.1mA to 300mA. CURRENT LIMIT (IIL) AIC1731 includes a current limiting, which monitors and controls the maximum output current if the output is shorted to ground. This can protect the device from being damaged. THERMAL PROTECTION Thermal sensor protects device when the junction temperature exceeds TJ= +155ºC. It signals shutdown logic, turning off pass transistor and allowing IC to cool down. After the IC’s junction temperature cools by 15ºC, the thermal sensor will turn the pass transistor back on. Thermal protection is designed to protect the device in the event of fault conditions. For a continuous operation, do not exceed the absolute maximum junction-temperature rating of TJ= 150ºC, or damage may occur to the device. APPLICATION INFORMATION INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1 µF with a 1uF aluminum electrolytic output capacitor is recommended. To avoid oscillation, ceramic capacitor is rejected. NOISE BYPASS CAPACITOR 0.1 µF bypass capacitor at BP pin reduces output voltage noise. And the BP pin has to connect a capacitor to GND. POWER DISSIPATION The maximum power dissipation of AIC1731 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: ) Rθ (Rθ ) T (T P BA JB A J MAX + − = |
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