W536030P/060P/090P/120P

Publication Release Date: May 21, 2003

- 7 -

Revision A4

PAD Description, continued

SYMBOL

I/O

FUNCTION

TEST

I

Test pad. Active high with internal pull low resistor.

ROSC

I

Connect resistor to VDD pad to generate speech or melody playing

clock source.

PWM1/DAC

O

While speech or melody is active, PWM1/DAC is speaker direct driving

output or DAC output controlled by voice output file.

PWM2

O

While speech or melody is active, PWM2 is another speaker direct

driving output.

ADDR

O

External serial memory address write clock for voice extension.

CLK

O

External serial memory address read clock for voice extension.

DATA

I/O

External serial memory data in/out for voice extension.

VSS

I

Chip ground.

VSSP

I

Chip ground for PWM or DAC playing output.

VSSA (3)

I

Chip ground. (W536090P/120P only)

VDD

I

Power source.

VDDP

I

Power source for PWM or DAC playing output.

VDDA (3)

I

Power source. (W536090P/120P only)

Notes:

(3). VDDA, VSSA for W536090P/120P only. To sure chip operation properly, please bond all VDD, VDDA, VDDP, VSS, VSSA

and VSSP pads, and connect VSS, VSSP form chip external PCB circuit.

(4). When working at NMOS open drain mode, external pull high voltage can't higher than VDD to avoid leakage current.

5. ELECTRICAL CHARACTERISTICS

5.1 Absolute Maximum Ratings

PARAMETER

RATING

UNIT

Supply Voltage to Ground Potential

-0.3 to +7.0

V

Applied Input/Output Voltage

-0.3 to +7.0

V

Power Dissipation

120

mW

Ambient Operating Temperature

0 to +70

°C

Storage Temperature

-55 to +150

°C

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability

of the device.