TM497FBK32, TM497FBK32S 4 194 304 BY 32-BIT

TM893GBK32, TM893GBK32S 8 388 608 BY 32-BIT

EXTENDED DATA OUT DYNAMIC RAM MODULES

SMMS668 – NOVEMBER 1996

7

POST OFFICE BOX 1443

– 1 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage range on any pin (see Note 1)

– 1 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Short-circuit output current

50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power dissipation

8 W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–55

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltage values are with respect to VSS.

recommended operating conditions

MIN

NOM

MAX

UNIT

VCC

Supply voltage

4.5

5

5.5

V

VIH

High-level input voltage

2.4

6.5

V

VIL

Low-level input voltage (see Note 2)

– 1

0.8

V

TA

Operating free-air temperature

0

70

°C

NOTE 2: The algebraic convention, where the more negative (less positive) limit is designated as minimum, is used for logic-voltage levels only.

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS‡

’497FBK32-60

’497FBK32-70

’497FBK32-80

UNIT

PARAMETER

TEST CONDITIONS‡

MIN

MAX

MIN

MAX

MIN

MAX

UNIT

VOH High-level output voltage

IOH = – 5 mA

2.4

2.4

2.4

V

VOL

Low-level output voltage

IOL = 4.2 mA

0.4

0.4

0.4

V

II

Input current (leakage)

VCC = 5.5 V,

VI = 0 V to 6.5 V,

All others = 0 V to VCC

± 10

± 10

± 10

µA

IO

Output current (leakage)

VCC = 5.5 V,

VO = 0 V to VCC,

CAS high

± 10

± 10

± 10

µA

ICC1

Read- or write-cycle current

(see Note 3)

VCC = 5.5 V,

Minimum cycle

880

800

720

mA

ICC2 Standby current

VIH = 2.4 V (TTL),

After one memory cycle,

RAS and CAS high

16

16

16

mA

ICC2 Standby current

VIH = VCC – 0.2 V (CMOS),

After one memory cycle,

RAS and CAS high

8

8

8

mA

ICC3

Average refresh current

(RAS only or CBR)

(see Note 3)

VCC = 5.5 V,

Minimum cycle,

RAS cycling,

CAS high

(RAS only);

RAS low after

CAS low (CBR)

880

800

720

mA

ICC4

Average page current

(see Note 4)

VCC = 5.5 V,

tPC = MIN,

RAS low,

CAS cycling

560

480

400

mA

‡ For test conditions shown as MIN / MAX, use the appropriate value specified under recommended operating conditions.

NOTES:

3. Measured with a maximum of one address change while RAS = VIL

4. Measured with a maximum of one address change while CAS = VIH