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CXT7090L Datasheet(PDF) 1 Page - Central Semiconductor Corp |
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CXT7090L Datasheet(HTML) 1 Page - Central Semiconductor Corp |
1 / 2 page Central Semiconductor Corp. TM 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PROCESS CP709 Power Transistor PNP - Low Saturation Transistor Chip PRINCIPAL DEVICE TYPES CMPT7090L CXT7090L CZT7090L CMXT7090L GEOMETRY PROCESS DETAILS R2 (12- September 2003) Process EPITAXIAL PLANAR Die Size 41.3 x 41.3 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 9.5 x 9.2 MILS Emitter Bonding Pad Area 12.8 x 10.2 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å GROSS DIE PER 4 INCH WAFER 6,670 |
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