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TSB17BA1 Datasheet(PDF) 7 Page - Texas Instruments |
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TSB17BA1 Datasheet(HTML) 7 Page - Texas Instruments |
7 / 15 page TSB17BA1 IEEE STD 1394b SINGLEPORT CABLE TRANSCEIVER SLLS568C − JANUARY 2004 − REVISED MARCH 2004 7 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics over recommended ranges of operating conditions (unless otherwise noted) driver PARAMETER TEST CONDITIONS TYP UNIT VOD Differential output voltage (BETA) 705 mV VOD Differential output voltage (UTP5) 500 mV IBETA Beta drive current, BETA_OUTP, BETA_OUTN Drivers enabled 12.5 mA IUTP5 UTP5 drive current, UTP5_OUTP, UTP5_OUTN Drivers enabled 10 mA receiver PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ZID Differential impedance Drivers disabled 4 7 k Ω ZID Differential impedance Drivers disabled 4 pF ZIC Common-mode impedance Drivers disabled 20 k Ω ZIC Common-mode impedance Drivers disabled 24 pF device PARAMETER TEST CONDITIONS TYP UNIT 3.3-V supply current† 4 IDDSTATIC VDDCORE supply current† No signals to driver inputs 4 mA IDDSTATIC 3.3-V supply current‡ No signals to driver inputs 7.5 mA 3.3-V supply current† 6 IDDDYN VDDCORE supply current† Normal operation 30 mA IDDDYN 3.3-V supply current‡ Normal operation 50 mA † Measured with internal regulator off, 1.8-V supply current from external source ‡ Measured with internal regulator on thermal characteristics PARAMETER TEST CONDITIONS TYP UNIT RθJA Junction-to-free-air thermal resistance Board mounted, no air flow, high conductivity TI-recommended test board, chip soldered or greased to thermal land with 2-oz copper (high-K 91.5 °C/W RθJC Junction-to-case thermal resistance board, chip soldered or greased to thermal land with 2-oz copper (high-K board) 41.2 °C/W RθJA Junction-to-free-air thermal resistance Board mounted, no air flow, high conductivity JEDEC test board with 1-oz 150.7 °C/W RθJC Junction-to-case thermal resistance Board mounted, no air flow, high conductivity JEDEC test board with 1-oz copper (low-K board) 41.2 °C/W |
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