Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.NET

X  

Preview PDF Download HTML

MB8M Datasheet(HTML) 1 Page - Shanghai Yint Electronic Co., Ltd

Part No. MB8M
Description  0.5A Surface Mount Glass Passivated Bridge Rectifier
Download  3 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Maker  YINT [Shanghai Yint Electronic Co., Ltd]
Homepage  https://www.yint.com.cn/
Logo 

MB8M Datasheet(HTML) 1 Page - Shanghai Yint Electronic Co., Ltd

   
Zoom Inzoom in Zoom Outzoom out
Go To Page :
/ 3 page
background image
Trustworthy electronic circuit protection expert
MB1M~MB10M
www.yint.com.cn
Rev:19.3
1
0.5A Surface Mount Glass Passivated Bridge Rectifier
Features
Glass Passivated Die Construction
Low Forward Voltage Drop
High Current Capability
High Surge Current Capability
Designed for Surface Mount Application
Plastic Material – UL Flammability 94V-O
Mechanical Date
Case:MBM, Molded Plastic
Terminals: Plated Leads Solderable per MIL-STD-202,
Method 208
Polarity: As Marked on Case
Weight:0.22 grams (approx.)
Mounting Position: Any
Marking:Type Number
Lead Free: For RoHS / Lead Free Version
Major Ratings and Characteristics
IO
0 5 A 0 8A
VRRM
100 V to 1000 V
IFSM
30 A
IR
5 μA
VF
1.0V
Tj max.
150 °C
Maximum Ratings & Thermal Characteristics (TA = 25 °C unless otherwise noted)
Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Items
Symbol
MB
1M
MB
2M
MB
4M
MB
6M
MB
8M
MB
10M
UNIT
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
100
200
400
600
800
1000
V
RMS Reverse Voltage
VR(RMS)
70
140
280
420
560
700
V
Average Rectified Output Current (1)@TA = 40°C
Average Rectified Output Current (2) @TA = 40°C
IO
0.5
0.8
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated
load(JEDEC Method)
IFSM
30
A
I2T Rating for Fusing (t < 8.3ms)
I2T
5
A2S
Thermal resistance from junction to lead(1)
RθJL
20
/W
Thermal resistance from junction to ambient(1)
RθJA
70
/W
Operating junction and storage temperature range
TJ, TSTG
-55…150
Note 1: Mounted on glass epoxy PC board with 1.3mm2 solder pad.
Note 2: Mounted on aluminum substrate PC board with 1.3mm2 solder pad.


Html Pages

1  2  3 


Datasheet Download




Link URL



Privacy Policy
ALLDATASHEET.NET
Does ALLDATASHEET help your business so far?  [ DONATE ]  

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Bookmark   |   Link Exchange   |   Manufacturer List
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn