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HCPL-786J Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard) |
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HCPL-786J Datasheet(HTML) 5 Page - Agilent(Hewlett-Packard) |
5 / 18 page 5 Solder Reflow Temperature Profile Recommended Lead Free IR Profile 217˚C RAMP-DOWN 6˚C/SEC. MAX. RAMP-UP 3˚C/SEC. MAX. 150 - 200˚C 260 +0/-5˚C t 25˚C to PEAK 60 to 150 SEC. 20-40 SEC. TIME WITHIN 5˚C of ACTUAL PEAK TEMPERATURE tp t s PREHEAT 60 to 180 SEC. t L T L T smax T smin 25 T p TIME (SECONDS) NOTES: THE TIME FROM 25˚C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200˚C, Tsmin = 150˚C UL Approval under UL 1577, component recognition program up to VISO = 3750 VRMS. File E55361. IEC/EN/DIN EN 60747-5-2 Approved under: IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01. Regulatory Information The HCPL-7860/HCPL-786J has been approved by the following organizations: CSA Approval under CSA Component Acceptance Notice #5, File CA 88324. 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160˚C 140˚C 150˚C PEAK TEMP. 245˚C PEAK TEMP. 240˚C PEAK TEMP. 230˚C SOLDERING TIME 200˚C PREHEATING TIME 150˚C, 90 + 30 SEC. 2.5˚C ± 0.5˚C/SEC. 3˚C + 1˚C/-0.5˚C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3˚C + 1˚C/-0.5˚C/SEC. REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC. |
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