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MC100EPT23DR2 Datasheet(HTML) 2 Page - ON Semiconductor

Part No. MC100EPT23DR2
Description  Dual Differential LVPECL to LVTTL Translator
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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MC100EPT23DR2 Datasheet(HTML) 2 Page - ON Semiconductor

   
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MC100EPT23
http://onsemi.com
2
1
2
3
45
6
7
8
Q0
GND
VCC
Figure 1. 8−Lead Pinout and Logic Diagram
D0
Q1
D1
D1
D0
LVPECL
LVTTL
(Top View)
Table 1. PIN DESCRIPTION
Pin
Function
Q0, Q1
LVTTL Outputs
D0**, D1**
D0**, D1**
Differential LVPECL Inputs
VCC
Positive Supply
GND
Ground
** Pins will default to VCC/2 when left open.
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
50 k
W
Internal Input Pullup Resistor
50 k
W
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 1500 V
> 100 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
91 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Power Supply
GND = 0 V
3.8
V
VI
Input Voltage
GND = 0 V
VI  VCC
3.8
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44
°C/W
Tsol
Wave Solder
< 2 to 3 sec @ 248
°C
265
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.


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