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CM3004-25SF Datasheet(PDF) 7 Page - California Micro Devices Corp |
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CM3004-25SF Datasheet(HTML) 7 Page - California Micro Devices Corp |
7 / 9 page © 2005 California Micro Devices Corp. All rights reserved. 01/10/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 7 CM3004 PRELIMINARY Performance Information (cont’d) CM3004 Typical Thermal Characteristics The overall junction to ambient thermal resistance ( θJA) for device power dissipation (PD) consists prima- rily of two paths in series. The first path is the junction to the case ( θJC) which is defined by the package style, and the second path is case to ambient ( θCA) thermal resistance which is dependent on board lay- out. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: TJUNC = TAMB + PD (θJC) + PD (θCA) = TAMB + PD ( θJA) The CM3004 uses a thermally enhanced package where all the GND pins (5 through 8) are integral to the leadframe. When this package is mounted on a double sided printed circuit board with two square inches of copper allocated for "heat spreading", the resulting θJA is about 50°C/W. Based on a typical operating power dissipation of 1.0W with an ambient of 85°C, the resulting junction temper- ature will be: TJUNC = TAMB + PD (θJA) = 85°C + 1.0W (50°C/W) = 85°C + 50°C = 135°C Thermal characteristics were measured using a double sided board with two square inches of copper area connected to the GND pins for "heat spreading". Mea- surement was performed under light load conditions (5mA). Temperature vs. Output Voltage (1.2V) 1.15 1.17 1.19 1.21 1.23 1.25 -40 25 85 Temperature ('C) Temperature vs. Output Voltage ( 2.5V ) 2.40 2.45 2.50 2.55 2.60 -40 -25 0 25 50 75 85 100 125 150 Temperature ('C) |
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