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THS3201DGKR Datasheet(PDF) 2 Page - Texas Instruments |
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THS3201DGKR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 29 page THS3201 SLOS416A − JUNE 2003 − REVISED JANUARY 2004 www.ti.com 2 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNIT Supply voltage, VS 16.5 V Input voltage, VI ±VS Output current, IO (2) 175 mA Differential input voltage, VID ±3 V Continuous power dissipation See Dissipation Rating Table Maximum junction temperature, TJ (3) 150 °C Maximum junction temperature, continuous operation, long term reliability TJ (4) 125 °C Operating free-air temperature range, TA −40 °C to 85°C Storage temperature range, Tstg −65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C HBM 3000 V ESD ratings: CDM 1500 V ESD ratings: MM 100 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The THS3201 may incorporate a PowerPAD on the underside of the chip. This acts as a heat sink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the PowerPAD thermally enhanced package. (3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. (4) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE DISSIPATION RATINGS PACKAGE θJC ( °C/W) θJA(1) ( °C/W) POWER RATING(2) (TJ = 125°C) PACKAGE JC ( °C/W) JA ( °C/W) TA ≤ 25°C TA = 85°C DBV (5) 55 255.4 391 mW 156 mW D (8) 38.3 97.5 1.02 W 410 mW DGN (8) 4.7 58.4 1.71 W 685 mW DGK (8 pin) 54.2 260 385 mW 154 mW (1) This data was taken using the JEDEC standard High-K test PCB. (2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125 °C for best performance and long term reliability. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT Supply voltage Dual supply ±3.3 ±7.5 V Supply voltage Single supply 6.6 15 V Operating free-air temperature, TA −40 85 °C PACKAGE/ORDERING INFORMATION PACKAGED DEVICES TEMPERATURE PLASTIC SMALL OUTLINE (D)(1) SOT-23(2) PLASTIC MSOP(1) POWERPAD PLASTIC MSOP(1) OUTLINE (D)(1) (DBV) SYM (DGN) SYM (DGK) SYM −40 °C to 85°C THS3201D THS3201DBVT BEO THS3201DGN BEN THS3201DGK BGP −40 °C to 85°C THS3201DR THS3201DBVR BEO THS3201DGNR BEN THS3201DGKR BGP (1) Available in tape and reel. The R suffix standard quantity is 2500 (e.g. THS3201DGNR). (2) Available in tape and reel. The R suffix standard quantity is 3000. The T suffix standard quantity is 250 (e.g. THS3201DBVT). PIN ASSIGNMENTS 1 2 3 4 8 7 6 5 NC VIN− VIN+ VS− NC VS+ VOUT− NC D, DGN, DGK TOP VIEW 3 2 4 5 1 VOUT VS− IN+ VS+ IN − SOT−23 TOP VIEW NC = No Internal Connection NOTE: If a PowerPAD is used, it is electrically isolated from the active circuitry. |
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