Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.NET

X  

Preview PDF Download HTML

GRM1882C1H5R0WA01D Datasheet(HTML) 16 Page - Murata Manufacturing Co., Ltd

Part No. GRM1882C1H5R0WA01D
Description  Chip Multilayer Ceramic Capacitors for General Purpose
Download  30 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Maker  MURATA1 [Murata Manufacturing Co., Ltd]
Homepage  http://www.murata.com
Logo 

GRM1882C1H5R0WA01D Datasheet(HTML) 16 Page - Murata Manufacturing Co., Ltd

Zoom Inzoom in Zoom Outzoom out
Go To Page :
/ 30 page
background image
4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
[Standard Conditions for Flow Soldering]
Table 2
Series
GRM
2. When sudden heat is applied to the components, the mechanical strength of the components will
decrease because a sudden temperature change causes deformation inside the components.
In order to prevent mechanical damage to the components, preheating is required for both of the
components and the PCB.
Preheating conditions are shown in table 2.
It is required to keep the temperature differential between the solder and the components surface
[Allowable Flow Soldering Temperature and Time]
(ΔT) as low as possible.
3. Excessively long soldering time or high soldering temperature can result in leaching of the
terminations, causing poor adhesion or a reduction in capacitance value due to loss of contact
between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting, be sure to maintain the temperature
differential (ΔT) between the component and solvent within the range shown in the table 2.
Recommended Conditions
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the thickness of the components.
If the solder amount is excessive, the risk of cracking is higher during board
bending or any other stressful condition.
Soldering Peak Temperature
250 to 260℃
Atmosphere
Air or N2
Chip Dimension(L/W) Code
Temperature Differential
18/21/31
ΔT≦150℃
Lead Free Solder
Preheating Peak Temperature
100 to 120℃
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature(℃)
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30 to 90 s
Preheating
5 s max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
GRM1882C1H5R0WA01-01A


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30 


Datasheet Download




Link URL



Privacy Policy
ALLDATASHEET.NET
Does ALLDATASHEET help your business so far?  [ DONATE ]  

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Bookmark   |   Link Exchange   |   Manufacturer List
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn