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S-19243H33H-E6T1U Datasheet(PDF) 54 Page - ABLIC Inc. |
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S-19243H33H-E6T1U Datasheet(HTML) 54 Page - ABLIC Inc. |
54 / 74 page (4) 1 2 3 4 (5) 1 2 3 4 Thermal via Number: 4 Diameter: 0.3 mm Number of copper foil layer 4 Pattern for heat radiation: 2000mm 2 t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 74.2 x 74.2 x t0.070 Thermal via - Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Board D Item Specification Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Number of copper foil layer Copper foil layer [mm] Board E Item Specification 4 Copper foil layer [mm] Pattern for heat radiation: 2000mm 2 t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 IC Mount Area HSNT-8(2030) Test Board No. HSNT8-A-Board-SD-2.0 enlarged view enlarged view ABLIC Inc. |
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