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S-19244G33A-E8T1U Datasheet(PDF) 50 Page - ABLIC Inc. |
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S-19244G33A-E8T1U Datasheet(HTML) 50 Page - ABLIC Inc. |
50 / 68 page (1) 1 2 3 4 (2) 1 2 3 4 (3) 1 2 3 4 Thermal via Number: 4 Diameter: 0.3 mm Number of copper foil layer 4 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 Board C Item Specification Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Board B Item Specification Thermal via - Material FR-4 Number of copper foil layer 4 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 Size [mm] 114.3 x 76.2 x t1.6 2 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 - - 74.2 x 74.2 x t0.070 Thermal via - Material FR-4 Board A Item Specification Size [mm] 114.3 x 76.2 x t1.6 Number of copper foil layer IC Mount Area HSNT-8(2030) Test Board No. HSNT8-A-Board-SD-2.0 enlarged view ABLIC Inc. |
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