2. Land Dimensions

　Please confirm the suitable land dimension by evaluating of the actual SET / PCB.

Table 1 Flow Soldering Method

Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.

(in mm)

Table 2 Reflow Soldering Method

0.6×0.3

(+/-0.03)

0.6×0.3

(+/-0.05)

0.6×0.3

(+/-0.09)

1.0×0.5

(within +/-0.10)

1.0×0.5

（+/-0.15/+/-0.20）

1.6×0.8

(within +/-0.10)

1.6×0.8

(+/-0.15/+/-0.20)

2.0×1.25

(within +/-0.10)

2.0×1.25

(+/-0.15)

2.0×1.25

(+/-0.20)

3.2×1.6

(within+/-0.20)

3.2×1.6

(+/-0.30)

(in mm)

GRM

55

5.7×5.0

4.0 to 4.6

1.4 to 1.6

3.5 to 4.8

GRM

43

4.5×3.2

3.0 to 3.5

1.2 to 1.4

2.3 to 3.0

GRM

32

3.2×2.5

2.0 to 2.4

1.0 to 1.2

1.8 to 2.3

1.2 to 1.4

GRM

31

1.8 to 2.0

0.9 to 1.2

1.5 to 1.7

1.9 to 2.1

1.0 to 1.3

1.7 to 1.9

GRM

21

1.2

0.6

1.25

1.2

0.6 to 0.8

1.2 to 1.4

1.0 to 1.4

0.6 to 0.8

GRM

JN

1.8×1.0

0.8 to 0.9

0.6 to 0.8

0.9 to 1.1

GRM

18

0.6 to 0.8

0.6 to 0.7

0.6 to 0.8

0.7 to 0.9

0.7 to 0.8

0.8 to 1.0

0.3 to 0.4

GRM

15

0.3 to 0.5

0.35 to 0.45

0.4 to 0.6

0.4 to 0.6

0.4 to 0.5

0.5 to 0.7

GRM

03

0.2 to 0.25

0.2 to 0.3

0.25 to 0.35

0.2 to 0.25

0.25 to 0.35

0.3 to 0.4

0.23 to 0.3

0.25 to 0.35

GRM

MD

0.5×0.25

0.17 to 0.23

0.22 to 0.28

0.25 to 0.30

GRM

02

0.4×0.2

0.16 to 0.2

0.12 to 0.18

0.2 to 0.23

GRM

01

0.25×0.125

0.10 to 0.11

0.07 to 0.12

0.125 to 0.145

Series

Chip Dimension(L/W) Code

Chip(L×W)

(Dimensions Tolerance)

a

b

c

GRM

31

3.2×1.6

2.2 to 2.6

1.0 to 1.1

1.0 to 1.4

GRM

21

2.0×1.25

1.0 to 1.2

0.9 to 1.0

0.8 to 1.1

GRM

18

1.6×0.8

0.6 to 1.0

0.8 to 0.9

0.6 to 0.8

Series

Chip Dimension(L/W) Code

Chip(L×W)

a

b

c

b

a

Solder Resist

Chip Capacitor

Land

GRM1882C1H5R8CA01-01A