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BS616LV8016FCP55 Datasheet(PDF) 8 Page - Brilliance Semiconductor |
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BS616LV8016FCP55 Datasheet(HTML) 8 Page - Brilliance Semiconductor |
8 / 8 page Revision 2.1 Jan. 2004 8 BS616LV8016 BSI R0201-BS616LV8016 ORDERING INFORMATION PACKAGE DIMENSIONS 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. N E D NOTES: 48 12.0 9.0 E1 D1 e 3.75 5.25 0.75 SIDE VIEW D0.1 D1 SOLDER BALL 0.35±0.05 VIEW A 3.375 48 mini-BGA (9mm x 12mm) Note: BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments. BS616LV8016 X X Z Y Y GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC SPEED 55: 55ns 70: 70ns PKG MATERIAL -: Normal G: Green P: Pb free PACKAGE F :BGA-48-0912 |
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