IRF6648

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3

Fig 1. Maximum Effective Transient Thermal Impedance, Junction-to-Case



Note

†

PCB with small clip heatsink (still air).

Notes:

Note

†

Note

‡

1E-006

1E-005

0.0001

0.001

0.01

0.1

t1 , Rectangular Pulse Duration (sec)

0.001

0.01

0.1

1

10

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthjc + Tc

Ri (°C/W)

τi (sec)

0.17199 0.000044

0.67673 0.001660

0.54961 0.007649

τ

J

τ

J

τ

1

τ

1

τ

2

τ

2

τ

3

τ

3

R

1

R

1

R

2

R

2

R

3

R

3

τ

C

τ

C

Ci=

τi/Ri

Ci=

τi/Ri

Absolute Maximum Ratings

Parameter

Units

Power Dissipation

h

W

Power Dissipation

h

Power Dissipation

f

Peak Soldering Temperature

°C

Operating Junction and

Storage Temperature Range

Thermal Resistance

Parameter

Typ.

Max.

Units

Junction-to-Ambient

hj

–––

45

Junction-to-Ambient

ij

12.5

–––

°C/W

Junction-to-Case

fj

–––

1.4

Junction-to-PCB Mounted

1.0

–––

270

-40 to + 150

Max.

2.8

1.8

89