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IRF6648 Datasheet(PDF) 3 Page - International Rectifier |
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IRF6648 Datasheet(HTML) 3 Page - International Rectifier |
3 / 9 page IRF6648 www.irf.com 3 Fig 1. Maximum Effective Transient Thermal Impedance, Junction-to-Case Note Surface mounted on 1 in. square Cu, steady state (still air). Used double sided cooling, mounted on 1 in. square Cu board PCB with small clip heatsink (still air). Notes: Rθ is measured at TJ of approximately 90°C. Note Note 1E-006 1E-005 0.0001 0.001 0.01 0.1 t1 , Rectangular Pulse Duration (sec) 0.001 0.01 0.1 1 10 0.20 0.10 D = 0.50 0.02 0.01 0.05 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc Ri (°C/W) τi (sec) 0.17199 0.000044 0.67673 0.001660 0.54961 0.007649 τ J τ J τ 1 τ 1 τ 2 τ 2 τ 3 τ 3 R 1 R 1 R 2 R 2 R 3 R 3 τ C τ C Ci= τi/Ri Ci= τi/Ri Absolute Maximum Ratings Parameter Units PD @TA = 25°C Power Dissipation h W PD @TA = 70°C Power Dissipation h PD @TC = 25°C Power Dissipation f TP Peak Soldering Temperature °C TJ Operating Junction and TSTG Storage Temperature Range Thermal Resistance Parameter Typ. Max. Units RθJA Junction-to-Ambient hj ––– 45 RθJA Junction-to-Ambient ij 12.5 ––– °C/W RθJC Junction-to-Case fj ––– 1.4 RθJ-PCB Junction-to-PCB Mounted 1.0 ––– 270 -40 to + 150 Max. 2.8 1.8 89 |
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