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TORX180 Datasheet(PDF) 7 Page - Toshiba Semiconductor |
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TORX180 Datasheet(HTML) 7 Page - Toshiba Semiconductor |
7 / 9 page TORX180 2001-08-10 7 7. Precaution on Use (1) Maximum rating The maximum ratings are the limit values which must not be exceeded during operation of device. None of these rating value must not be exceeded. If the maximum rating value is exceeded, the characteristics of devices may never be restored properly. In extreme cases, the device may be permanently damages. (2) Soldering Optical modules are comprised of internal semiconductor devices. However, in principle, optical modules are optical components. During soldering, ensure that flux does not contact with the emitting surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering. Some optical modules come with a protective cap. The protective cap is used to avoid malfunction when the optical module is not in use. Note that it is not dust or waterproof. As mentioned before, optical modules are optical components. Thus, in principle, soldering where there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend that soldering be performed without the optical module mounted on the board. Then, after the board has been cleaned, the optical module should be soldered on to the board manually. If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of flux. In such a cases, be sure to check the devices’ reliability. (3) Noise resistance It is believed that the use of optical transfer devices improve noise resistance. In theory, optical fiber is not affected by noise at all. However, receiving modules which handle signals whose level is extremely small, are susceptible to noise. TOSLINK improve noise resistance to use a conductive case. However, the current signal output by the optical receiving modules' photodiode is extremely small. Thus, in some environments, shielding the case may not achieve sufficient noise resistance. First systems which incorporate TOSLINK, Toshiba recommend testing using the actual device to check its noise resistance. Use a simple noise filter on TOSLINK fiber optic transceiving module's power line. If the ripple in the power supply used is significant, reinforce the filter. The optical module is to be used in an area which is susceptible to radiated noise, increase the shielding by covering the optical module and the power line filter with a metallic cover. (4) Vibration and shock This module is ceramic packaged which internal device is hollow so that the wire is not fixed to the device. This structure is not relatively sound against vibration and shock. Attention must be paid to the design of the mechanism for applications which are subject to large amounts of vibration. (5) Fixing fiber optical receiving module Solder the fixed pin (pins 5 and 6) of fiber optic receiving module TORX180 to the printed circuit board to fix the module to the board. (6) Shielding and wiring pattern of fiber optic receiving modules To shield, connect the fixed pins (pins 5 and 6) of fiber optic transceiving module TORX180 to the GND. Where the fiber optic receiving module uses conductive resin, be careful that the case does not touch wiring (including land). To improve noise resistance, shield the optical module and the power line filter using a metallic cover. (7) Solvent When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off using cotton tips. (8) Protective cap When the TORX180 is not in use, attach the protective cap. (9) Supply voltage Use the supply voltage within the recommended operating condition (VCC = 5 ± 0.25 V). Make sure that supply voltage does not exceed the maximum rating value of 7 V, even for an instant. (10) Output If the receiver output is at low and is connected to the power supply, or if the output is high and is connected to GND, the internal IC may be destroyed. |
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