2

FN8169.2

September 16, 2005

Ordering Information

PART

NUMBER

PART MARKING

(V)

(k

Ω)

TEMPERATURE RANGE

(°C)

PACKAGE

X9259TS24*

X9259TS

5 ±10%

100

0 to 70

24 Ld SOIC

X9259TS24Z* (Note)

X9259TS Z

0 to 70

24 Ld SOIC (Pb-free)

X9259TS24I*

X9259TS I

-40 to 85

24 Ld SOIC

X9259TS24IZ* (Note)

X9259TS Z I

-40 to 85

24 Ld SOIC (Pb-free)

X9259TV24

X9259TV

0 to 70

24 Ld TSSOP

X9259TV24Z* (Note)

X9259TV Z

0 to 70

24 Ld TSSOP (Pb-free)

X9259TV24I

X9259TV I

-40 to 85

24 Ld TSSOP

X9259TV24IZ (Note)

X9259TV Z I

-40 to 85

24 Ld TSSOP (Pb-free)

X9259US24*

X9259US

50

0 to 70

24 Ld SOIC

X9259US24Z* (Note)

X9259US Z

0 to 70

24 Ld SOIC (Pb-free)

X9259US24I*

X9259US I

-40 to 85

24 Ld SOIC

X9259US24IZ* (Note)

X9259US Z I

-40 to 85

24 Ld SOIC (Pb-free)

X9259UV24

X9259UV

0 to 70

24 Ld TSSOP

X9259UV24Z (Note)

X9259UV Z

0 to 70

24 Ld TSSOP (Pb-free)

X9259UV24I*

X9259UV I

-40 to 85

24 Ld TSSOP

X9259UV24IZ* (Note)

X9259UV Z I

-40 to 85

24 Ld TSSOP (Pb-free)

X9259TS24-2.7*

X9259TS F

2.7-5.5

100

0 to 70

24 Ld SOIC

X9259TS24Z-2.7* (Note)

X9259TS Z F

0 to 70

24 Ld SOIC (Pb-free)

X9259TS24I-2.7*

X9259TS G

-40 to 85

24 Ld SOIC

X9259TS24IZ-2.7* (Note)

X9259TS Z G

-40 to 85

24 Ld SOIC (Pb-free)

X9259TV24-2.7

X9259TV F

0 to 70

24 Ld TSSOP

X9259TV24Z-2.7 (Note)

X9259TV Z F

0 to 70

24 Ld TSSOP (Pb-free)

X9259TV24I-2.7

X9259TV G

-40 to 85

24 Ld TSSOP

X9259TV24IZ-2.7 (Note)

X9259TV Z G

-40 to 85

24 Ld TSSOP (Pb-free)

X9259US24-2.7*

X9259US F

50

0 to 70

24 Ld SOIC

X9259US24Z-2.7* (Note)

X9259US Z F

0 to 70

24 Ld SOIC (Pb-free)

X9259US24I-2.7*

X9259US G

-40 to 85

24 Ld SOIC

X9259US24IZ-2.7* (Note)

X9259US Z G

-40 to 85

24 Ld SOIC (Pb-free)

X9259UV24-2.7*

X9259UV F

0 to 70

24 Ld TSSOP

X9259UV24Z-2.7 (Note)

X9259UV Z F

0 to 70

24 Ld TSSOP (Pb-free)

X9259UV24I-2.7*

X9259UV G

-40 to 85

24 Ld TSSOP

X9259UV24IZ-2.7* (Note)

X9259UV Z G

-40 to 85

24 Ld TSSOP (Pb-free)

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

*Add "T1" suffix for tape and reel.

X9259