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EL7457CU Datasheet(PDF) 9 Page - Intersil Corporation |
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EL7457CU Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 12 page 9 FN7288.3 January 3, 2005 Block Diagram Applications Information Product Description The EL7457 is a high performance 40MHz high speed quad driver. Each channel of the EL7457 consists of a single P- channel high side driver and a single N-channel low side driver. These 3 Ω devices will pull the output (OUTX) to either the high or low voltage, on VH and VL respectively, depending on the input logic signal (INX). It should be noted that there is only one set of high and low voltage pins. A common output enable (OE) pin is available on the EL7457. This pin, when pulled low will put all outputs in to the high impedance state. The EL7457 is available in 16-pin SO (0.150"), 16-pin QSOP, and ultra-small 16-pin QFN packages. The relevant package should be chosen depending on the calculated power dissipation. Supply Voltage Range and Input Compatibility The EL7457 is designed for operation on supplies from 5V to 15V with 10% tolerance (i.e. 4.5V to 18V). The table on page 6 shows the specifications for the relationship between the VS+, VS-, VH, VL, and GND pins. The EL7457 does not contain a true analog switch and therefore VL should always be less than VH. All input pins are compatible with both 3V and 5V CMOS signals With a positive supply (VS+) of 5V, the EL7457 is also compatible with TTL inputs. Power Supply Bypassing When using the EL7457, it is very important to use adequate power supply bypassing. The high switching currents developed by the EL7457 necessitate the use of a bypass capacitor on both the positive and negative supplies. It is recommended that a 4.7µF tantalum capacitor be used in parallel with a 0.1µF low-inductance ceramic MLC capacitor. These should be placed as close to the supply pins as possible. It is also recommended that the VH and VL pins have some level of bypassing, especially if the EL7457 is driving highly capacitive loads. Power Dissipation Calculation When switching at high speeds, or driving heavy loads, the EL7457 drive capability is limited by the rise in die temperature brought about by internal power dissipation. For reliable operation die temperature must be kept below TJMAX (125°C). It is necessary to calculate the power dissipation for a given application prior to selecting package type. Power dissipation may be calculated: where: VS is the total power supply to the EL7457 (from VS+ to VS-) VOUT is the swing on the output (VH - VL) CL is the load capacitance CINT is the internal load capacitance (80pF max) IS is the quiescent supply current (3mA max) f is frequency Having obtained the application’s power dissipation, the maximum junction temperature can be calculated: where: TJMAX is the maximum junction temperature (125°C) TMAX is the maximum ambient operating temperature PD is the power dissipation calculated above θJA is the thermal resistance, junction to ambient, of the application (package + PCB combination). Refer to the Package Power Dissipation curves on page 6. 3-STATE CONTROL LEVEL SHIFTER OUTPUT VL VH OE INPUT VS+ GND VS- PD VS IS × () CINT VS 2 × f × () CL VOUT 2 × f × () + 1 4 ∑ + = TJMAX TMAX ΘJA PD × + = EL7457 |
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