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ISL3874 Datasheet(PDF) 9 Page - Intersil Corporation |
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ISL3874 Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 33 page 9 Absolute Maximum Ratings Thermal Information Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4V Input, Output or I/O Voltage . . . . . . . . . . . GND -0.5V to VCC +0.5V ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2 Operating Conditions Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.3V Ambient Temperature Range. . . . . . . . . . . . . . . . . . . -40oC to 85oC Thermal Resistance (Typical, Note 1) θJA (oC/W) BGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 100oC Maximum Soldering Temperature . . . . . . . . . See Tech Brief TB334 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. DC Electrical Specifications (Test conditions @ 25oC) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Power Supply Current ICCOP VCC = 3.6V, CLK Frequency = 44MHz - 170 TBD mA Standby Power Supply Current ICCSB VCC = Max, Outputs Not Loaded - 3 TBD mA Input Leakage Current II VCC = Max, Input = 0V or VCC - 100 TBD nA Output Leakage Current IO VCC = Max, Input = 0V or VCC - 300 TBD nA Logical One Input Voltage VIH VCC = Max, Min 0.7VCC - - V Logical Zero Input Voltage VIL VCC = Min, Max - - VCC*0.3 V Logical One Output Voltage VOH IOH = -1mA, VCC = Min VCC-0.2 2.6 - V Logical Zero Output Voltage VOL IOL = 2mA, VCC = Min - 0.05 0.2 V Input Capacitance CIN CLK Frequency = 1MHz. All measurements referenced to GND. TA = 25 oC - 5 10 pF Output Capacitance COUT CLK Frequency 1MHz. All measurements referenced to GND. TA = 25 oC - 5 10 pF NOTE: All values in this table have not been measured and are only estimates of the performance at this time. AC Electrical Specifications PARAMETER SYMBOL MIN TYP MAX UNITS CLOCK SIGNAL TIMING OSC Clock Period (Typ. 44MHz) tCYC 22.5 20.8 200 ns High Period tH1 10 10.4 - ns Low Period tL1 10 10.4 - ns Full Scale Input Voltage (VP-P) TBD TBD 4 V EXTERNAL MEMORY READ INTERFACE MOE-Setup Time from RAMCS_ tS1 0 - - ns MOE_Setup Time from MA (17..0) tS2 0 - - ns MA (17..1) Hold Time from MOE_ Rising Edge tH1 20 - - ns RAMCS_ Hold from MOE_ Rising Edge tH2 20 - - ns MD (15..0) Enable from MOE_ Falling tE1 5 - - ns MO (15..0) Disable from MOE_ Rising Edge tD1 - - 100 ns EXTERNAL MEMORY WRITE INTERFACE MA (17..0) Setup to MWE_ Falling Edge tS3 0 0 0 ns RAMCS_ Setup to MWE tS4 0 - - ns MA (17..0) Hold from MWE_ Rising Edge tH3 15 - - ns RAMCS _ Hold from MWE_ Rising Edge tH4 15 - - ns MD (15..0) Setup to MWE_ Rising Edge tS5 40 - - ns MD (15..0) Hold from MWE_ Rising Edge tH5 15 - - ns ISL3874 |
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