MC74HC1GU04

http://onsemi.com

2

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage

*0.5 to )7.0

V

DC Input Voltage

V

DC Output Voltage

V

DC Input Diode Current

$20

mA

DC Output Diode Current

$20

mA

DC Output Sink Current

$12.5

mA

DC Supply Current per Supply Pin

$25

mA

Storage Temperature Range

*65 to )150

_C

Lead Temperature, 1 mm from Case for 10 Seconds

260

_C

Junction Temperature Under Bias

)150

_C

Thermal Resistance

SC70−5/SC−88A/SOT−353 (Note 1)

SOT23−5/TSOP−5/SC59−5

350

230

_C/W

Power Dissipation in Still Air at 85

_C

SC70−5/SC−88A/SOT−353

SOT23−5/TSOP−5/SC59−5

150

200

mW

MSL

Moisture Sensitivity

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

u2000

u200

N/A

V

Latchup Performance

$500

mA

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage

2.0

6.0

V

DC Input Voltage

0.0

V

DC Output Voltage

0.0

V

Operating Temperature Range

*55

)125

_C

Input Rise and Fall Time

0

0

0

0

1000

600

500

400

ns

DEVICE JUNCTION TEMPERATURE VERSUS

TIME TO 0.1% BOND FAILURES

Junction

Temperature

°C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 3. Failure Rate vs. Time Junction Temperature

TIME, YEARS