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GENERAL INFORMATION

TERMINAL ASSIGNMENT

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PGND_EF

PWM_F

GVDD_DEF

VDD

PWM_E

PWM_D

RESET

M3

M2

M1

GND

AGND

VREG

OC_ADJ

SD

OTW

PWM_C

PWM_B

PWM_A

GVDD_ABC

BST_BIAS

OUT_BIAS

DDV PACKAGE

(TOP VIEW)

BST_F

PVDD_F

OUT_F

PGND_EF

OUT_E

PVDD_E

BST_E

BST_D

PVDD_D

OUT_D

PGND_D

PGND_C

OUT_C

PVDD_C

BST_C

BST_B

PVDD_B

OUT_B

PGND_AB

OUT_A

PVDD_A

BST_A

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P0016-01

TAS5186

SLES136 – MAY 2005

These devices have limited built-in ESD protection. The leads should be shorted together or the device

placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

The TAS5186 is available in a thermally enhanced 44-pin HTSSOP PowerPAD™ package. The heat slug is

located on the top side of the device for convenient thermal coupling to a heatsink.

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