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LP5910 Datasheet(PDF) 29 Page - Texas Instruments |
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LP5910 Datasheet(HTML) 29 Page - Texas Instruments |
29 / 35 page www.ti.com PACKAGE OUTLINE C 6X 0.35 0.25 1.6 0.1 6X 0.3 0.2 2X 1.3 1 0.1 4X 0.65 0.8 0.7 0.05 0.00 B 2.1 1.9 A 2.1 1.9 (0.2) TYP WSON - 0.8 mm max height DRV0006A PLASTIC SMALL OUTLINE - NO LEAD 4222173/B 04/2018 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 3 4 6 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED 7 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500 |
Similar Part No. - LP5910_V02 |
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Similar Description - LP5910_V02 |
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