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MSP430F5310 Datasheet(PDF) 19 Page - Texas Instruments |
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MSP430F5310 Datasheet(HTML) 19 Page - Texas Instruments |
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19 / 109 page  19 MSP430F5310, MSP430F5309, MSP430F5308, MSP430F5304 www.ti.com SLAS677G – SEPTEMBER 2010 – REVISED MAY 2020 Submit Documentation Feedback Product Folder Links: MSP430F5310 MSP430F5309 MSP430F5308 MSP430F5304 Specifications Copyright © 2010–2020, Texas Instruments Incorporated (1) N/A = not applicable (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. 5.6 Thermal Resistance Characteristics (1) THERMAL METRIC VALUE UNIT RθJA Junction-to-ambient thermal resistance, still air (2) VQFN (RGC) 30 °C/W VQFN (RGZ) 28.6 LQFP (PT) 62.8 BGA (ZQE) 55.5 RθJC(TOP) Junction-to-case (top) thermal resistance (3) VQFN (RGC) 15.6 °C/W VQFN (RGZ) 14.4 LQFP (PT) 18.2 BGA (ZQE) 21.2 RθJC(BOTTOM) Junction-to-case (bottom) thermal resistance (4) VQFN (RGC) 1.6 °C/W VQFN (RGZ) 1.6 LQFP (PT) N/A BGA (ZQE) N/A RθJB Junction-to-board thermal resistance (5) VQFN (RGC) 8.9 °C/W VQFN (RGZ) 5.5 LQFP (PT) 28.3 BGA (ZQE) 19.3 |
Similar Part No. - MSP430F5310_V01 |
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Similar Description - MSP430F5310_V01 |
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